Two-Phase Thermal Design Library

Engineering tools, CAD resources, and technical guidance for designing with heat pipes, vapor chambers, and thermosiphons.

resources Categories

Electronic Cooling
System Selection

  • Heat Sink Types
  • How to Choose
  • Two-Phase Cooling

Thermal Design Considerations

Application Notes & Whitepapers

  • Process cooling guide
  • Electronics cooling examples
  • Case studies

How Engineers Use This Library

A practical step-by-step workflow for selecting and integrating two-phase thermal solutions.

01

Identify your thermal constraints

02

Review applicable design resources

03

Select the appropriate two-phase technology

04

Download CAD drawings or reference data

05

Engage engineering for design optimization

Quick Design Reference

Device to Application Fit

Heat Pipe: High heat flux, small footprint.

Vapor Chamber: Isothermal surface, even distribution.

Thermosiphons: Gravity-assisted, vertical orientation.

Loop Thermosiphons: Remote heat removal, flexible piping.

Wick Selection

Grooved Wick: High heat flux, low cost, orientation dependent.

Sintered Wick: High capillary limit, supports gravity-defying orientations.

Mesh Wick: Design flexibility, high permeability, lower cost.

Working Fluid Comparison

Water: 5°C to 150°C, high efficiency.

Ammonia: -60°C to 60°C, aerospace.

Methanol: -40°C to 120°C, moderate performance.

Acetone: -40°C to 120°C, fast response time.

Orientation Sensitivity

Horizontal: Maintains stability across wide gravity.

Against Gravity: High reliability, requires sintered wicks.

With Gravity: High reliability, gravity-assisted.

Loop Thermosiphons: Naturally separates vapor/liquid phases.

Typical Implementation

Heat Pipe Assembly: Air-cooled fins and fan.

Heat Spreaders: High density heat dissipation.

Vapor Chamber: Integrated base plates.

Hit-Sink Units: Direct device attachment.

Recently Added Design Resources

Selecting the Right Two-Phase Material
Selecting the Right Two-Phase Material
Designing for High-Heat Flux Density in CPUs and GPUs
Designing for High-Heat Flux Density in CPUs and GPUs
Extreme Economics: Cooling Application Note
Extreme Economics: Cooling Application Note